Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2017
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Host: Japan Institute of Electronics Packaging

MES2017
Investigation on a Correlation between Thermal Resistance and Vertical Fracture in a Die-Bonding Layer of a Power Module
*[in Japanese], [in Japanese], [in Japanese]
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 57-60

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© 2017 The Japan Institute of Electronics Packaging
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