Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2018
Conference information

MES2018
Effects of Build-up Material Properties on Warpage Dispersion of Organic Substrates
*[in Japanese][in Japanese][in Japanese]
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 181-184

Details
Article 1st page
Content from these authors
© 2018 The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top