MES2022
Conference information
Host: Japan Institute of Electronics Packaging
MES2022
Relationship Between Wire-Liftoff Lifetime of Aluminum Wire Bond for Power Modules Obtained by Cyclic Four-Point Bending Test and Inelastic Strain Range
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Author information
Pages 137-140
Details
Article 1st page
