Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2022
Conference information

Host: Japan Institute of Electronics Packaging

MES2022
Bonding reliability of encapsulation epoxy and substrate for power modules under high-temperature agin
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 265-268

Details
Download PDF (1881K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2022 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top