Improving Properties through Structure and Formulation of Maleimide Resins

Abstract

In recent years, with the expansion of the high-speed communication technology market, Low Dk and Low Df properties have become important for resins used in electronic devices. This influence is particularly noticeable in the material of printed circuit board applications, and various Low Dk and Low Df materials have been proposed to replace the commonly used epoxy resins. Especially, maleimide resins are gathered attention, because they can achieve not only high heat resistance and Low Df, but also have various reactivity. This report shows the relationship between the structure and properties of maleimide resins, as well as the formulations and properties of various curing systems.