フレキシブルハイブリッドエレクトロニクスの基盤技術と応用展開

抄録

Flexible hybrid electronics (FHE) technology is a new trend in printed electronics, where mature silicon LSI devices are employed for signal processing and wireless communication circuits. This paper reviews the fundamentals and applications of FHE devices, including printing materials, printing processes, and low-temperature LSI chip mounting technology. Flexible printed sensors based on organic materials for FHE devices are briefly described. Screen printing is used to form circuit patterns, an antenna, and sensors on a flexible plastic film substrate. Thin Si-LSI chips and other components are then mounted on the printed interconnect layers using low-temperature soldering. A Bluetooth low energy (BLE) or near-field communication (NFC) system is used for data transmission. We highlight the essential steps of device fabrication. Finally, we demonstrate practical FHE devices with sensors for healthcare and logistics applications. This FHE technology can be easily applied to various sensor systems connected to a network in an IoT environment.