抄録
Disulfide bonds are stable at room temperature, while their exchange reactions are caused with mild heating. A methacryl resin-based photo-adhesive material containing disulfide bonds were developed for adhesion between some dissimilar substrates. This material would be also utilized for reuse of the adhesive layers themselves as well as the substrates. A bi-functional methacryl monomer having a disulfide bond was designed and synthesized in a 21% yield. This monomer was used in a radical UV curing system, to obtain ca. 6 MPa of shear stress after 1 J/cm2 of UV irradiation at a wavelength of 365 nm. It was found that a glass-glass photo-adhesive sample was thermally dismantled at 55oC, while complete cohesive failure was not observed. A preliminary re-adhesion test was then performed with corresponding UV-cured films, suggesting that disulfide bonds would contribute to fuse two films at their interfaces in molecular level.
https://ror.org/01n09qc98 
