Abstract
Dynamic characterization of thermal shock fracture behavior in oxide ceramics by Disk-on-Rod test was conducted. In this study, the disk specimen with 20mm diameter of Al2O3/SiC(w) was heated to high temperature and quenched by means of contacting with the cool metal rod. The temperature distribution on the disk specimen was measured by IR camera and thermal stress was calculated by finite element method. Comparing the critical stress of the main crack formation by the plane bending test, it was found that σc increased in thermal shock test due to the relaxation of thermal residual stress.
