Abstract
Spin-coating was conducted on silicon wafers using xylene solution of polysilazane as the coating solution. The films obtained were exposed to vapor of various acidic and basic solutions at room temperature. Durability of the films in hot water was examined by evaluating the reduction in thickness on immersing the films in distilled water at 80°C. The film just dried in the ambient atmosphere showed reduction in thickness from 0.13 to 0.03 micron when soaked in the hot water for 1 day. The films placed over NH3 aq. or C2H5NH2 aq. for 18 h, on the other hand, showed no reduction in thickness even when soaked in the hot water for 5 days.
