抄録
Nowadays, Ni-MLCC with about 1.4mm active layer thickness and more than 800 active layers are under mass-production. Permanent challenges for improving the dielectric materials including the powder handling and co-firing technologies must be required for further increase of the capacitance volumetric efficiency. It is well known that the material with flat temperature characteristics has so-called grain core-grain shell structure and the microstructure plays an important role on the electrical properties and the dc electrical degradation. We previously reported that microstructure and the electrical properties were dependent on the degree of damage on BaTiO3 particles given by milling process. In this study, the elaborate transmission electron microscope (TEM) observation and spot element analysis (EDS) have been done. The relationship between the core-shell microstructure and the degree of damage will be discussed.
