抄録
Particle morphology evaluation methods for size, in-between/on-surface amounts and shape are submitted; and their potentials are correlated on a semiconductor packaging material. Semiconductor encounters a big resistance on heat radiation. The package (consisted with silica-particle & resin) is a promising path of heat. Dense particle packing can be an essential solution. To improve the density, the particle morphology indices are indispensable. This paper offers some new parameters and their detection route of the morphological indices by a virtual classification method. This method bases its sieve-scale on differences of measurable-size, time, magnification, angle & volume/area-ratio of several particle analyzers. These indices clarify that the conventional and/or high-purity silicas of the packaging material have an opposite characteristic on the relationship between size-distribution and rheological-property. This shows that the above morphological-indices and their detection methods can be a case in point of practical evaluation route to examine the package in the industrialization viewpoints.
