抄録
The insoluble CuPc/TiO2 composite thin film has been successfully prepared by LPD method applying SDS as a dispersing agent. The films were formed directly on the substrate from the mixed solution of [NH4]2TiF6, H3BO3 and CuPc-SDS solution. The films showed excellent adherence to substrate and were characterized a homogeneous flat surface with 10snm in particle diameter, and 280nm in thickness. It is confirmed that CuPc is in dimer form both in solution and films by UV-Vis spectroscopy. Deposited Ti & Cu in films were measured by ICP or Fluorescence X-Ray. The dependences of deposited amount of Ti and Cu, film thickness on the reaction time strongly suggested that the growing of the film can be easily controlled.
