Abstract
Electroless plating solutions were employed to fabricate the tiny particles of copper or copper(I) oxide in the volume of solutions by controlling the pH values and additives. Selective deposition of both copper and copper(I) oxide particles were observed in the appropriate aqueous solutions onto self-assembled monolayers (SAM) terminated with NH2 instead of OH headgroups individually, as a result, micro patterns were successfully fabricated on the UV-patterned SAM with NH2 and OH terminals. Considering the difference in charged conditions between copper and copper(I) oxide tiny particles (negative) formed in the volume of solutions and SAM surfaces (NH2-SAM: positive; OH-SAM, negative), it is conceivable that the electrostatic interactions should be strongly responsible for the selective deposition.
