Volume 18 (2005) Issue 2 Pages 237-241
A three-dimensional scanning microplasma jet etcher (3D-SMPJE) which works independently of x, y and z axes and enables localized and ultra high-rate silicon wafer etching has been developed. In this paper, the 3D-SMPJE was investigated for its fundamental characteristics and then three-dimensional microfabrications were carried out using Ar/SF6 etching gases on silicon (Si) wafers. It is shown that by controlling L and etching time, one can obtain reproducible etched profiles. In addition, with this novel technology, maskless patterning and precise three-dimensional micromachining with smooth surfaces were achieved.