Journal of Photopolymer Science and Technology
3 Dimensional Silicon Micromachining Using a Scanning Microplasma Jet Source
Halen M. L. TanTakuya IkedaTakanori Ichiki
Author information

Volume 18 (2005) Issue 2 Pages 237-241

Download PDF (353K) Contact us

A three-dimensional scanning microplasma jet etcher (3D-SMPJE) which works independently of x, y and z axes and enables localized and ultra high-rate silicon wafer etching has been developed. In this paper, the 3D-SMPJE was investigated for its fundamental characteristics and then three-dimensional microfabrications were carried out using Ar/SF6 etching gases on silicon (Si) wafers. It is shown that by controlling L and etching time, one can obtain reproducible etched profiles. In addition, with this novel technology, maskless patterning and precise three-dimensional micromachining with smooth surfaces were achieved.

Information related to the author
© 2005 The Society of Photopolymer Science and Technology (SPST)
Previous article Next article

Recently visited articles