Preparation of Photo-curing Acrylate Thin films containing Pd Nanoparticles and their Application for Electroless Plating Catalyst

Abstract

A novel strategy to fabricate the copper pattem by electroless copper plating was investigated. The photolithographic negative pattems were fabricated by the hybrid f11ms with the palladium nanoparticles. The palladium nanoparticles in photo-cured acrylate thin films were an effective catalyst for the electroless copper plating, and it was easily to form the catalysis flne patterns by UV irradiation and development. Addition of silica nanoparticles to the hybrid thin fllms enhanced the performance of catalyst for the electroless copper plating and adhesion between the thin f11m and deposited copper.