抄録
A polyimidepolysiloxane was synthesized from 2,3,3',4'-biphenyltetracarboxylic acid dianhydride, 5,5'-methylene-bis(antranilic acid) and (,(-bis(3-aminopropyl)polydimethylsiloxane. It was used for a heat-curable solder resist having flame retardancy without flame retardant agent such as halogenated compounds. Addition of talc to the composition was effective for increasing flame retardancy. The developed solder resist achieved level 0 in UL94V test in TCP-type layered product. It had excellent flexibility and insulation reliability under a high-temperature and high-humidity environment.
