Pinning Effect of Micro Bubbles adhered on Resist Substrate

Abstract

We discuss adhesion and removal properties of micro bubbles based on thermodynamics. It is important to consider the remove technique of micro bubbles from resist surface. A micro defect on a resist surface acts to enhance the adhesion of micro bubble on to them. It is cleared that the defect such as a solid particle and a resist fragment are more likely to capture the micro bubbles due to pinning effect. It is clarified that the removal mechanism can be explained based on surface energy balance model. Consequently, one can safely state that the removal of micro bubble from the F2 excimer resist film is required a certain external load. The capture mechanism of micro bubbles at the micro defect is analyzed based on the pinning effect.