Study on Adhesion Improvement of Polyimide Film

Kohji Katoh; Takeharu Motobe; Masayuki Ohe; Kazuya Soejima; Yuichi Kaneya; Toshiaki Tanaka; Toshiaki Itabashi

doi:10.2494/photopolymer.22.393

Kohji Katoh, Takeharu Motobe, Masayuki Ohe, Kazuya Soejima, Yuichi Kaneya, Toshiaki Tanaka, Toshiaki Itabashi

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Keywords: polyimide, adhesion, anisotropic conductive film, under-fill molding compound, plasma treatment

JOURNAL FREE ACCESS

2009 Volume 22 Issue 3 Pages 393-396

DOI https://doi.org/10.2494/photopolymer.22.393

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Abstract

Polyimide (PI) materials have been widely used as stress buffer and rewiring cover layers to improve semiconductor reliability. As these applications require compatibility with various organic and/or inorganic materials, the effect of plasma treatment on the adhesion of PI to an anisotropic conductive film (ACF) and an under-fill molding compound (UF) was investigated. In this paper, several gases were tested and the results found that N2 plasma treatment of the PI film produced an improvement in the adhesion of the PI to both ACF and UF due to stronger bonding at the interface.

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