Abstract
Process simulation systems for UV nanoimprint lithography (NIL) has been developed to investigate process science and resist profiles. The system consist of 4 modules, which simulate fluid dynamics in resist filling process into pattern, optical intensity distribution in UV exposure process, mechanical properties in UV curing, and resist profiles by UV shrinkage. Each module is independent but share physical parameters and resist profiles. Simulations on bubble trapping in resist filling process and resist curing in UV exposure process are demonstrated.
