Metal Liftoff Process using Solvent Soluble Resist by UV-NIL

Tomoki Nishino; Noriyoshi Fujii; Hiroto Miyake; Takao Yukawa; Junji Sakamoto; Ryosuke Suzuki; Hiroaki Kawata; Yoshihiko Hirai

doi:10.2494/photopolymer.23.87

Tomoki Nishino, Noriyoshi Fujii, Hiroto Miyake, Takao Yukawa, Junji Sakamoto, Ryosuke Suzuki, Hiroaki Kawata, Yoshihiko Hirai

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Keywords: UV nanoimprint, metal, liftoff, Plasmon, solvent

JOURNAL FREE ACCESS

2010 Volume 23 Issue 1 Pages 87-90

DOI https://doi.org/10.2494/photopolymer.23.87

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Abstract

Metal liftoff process has been demonstrated using solvent soluble UV cuable resin by UV nanoimprint lithography. Fine pattern is fabricated by UV nanoimprint using NIAC702 resist (Daisel Chemical), which is solved into Cyclohexanone. After removing residual layer by plasma etching, Cr is deposited by electron beam spattering and the resist is dissolved by Cyclohexanone. Using solvent soluble UV curable resin, Cr pattern is successfully transferred on the substrate by liftoff process.

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