Plasma-induced Damages to Polyimide Diaphragms during Si Dry-etching in Micropump Fabrication Processes
キーワード:
Non-flammability,
Poly(ester imide)s,
Low-modulus polyimides,
Phosphorus-containing monomers,
Copper clad laminates,
Cover layers,
Flexible printed circuit boards
2011 年 24 巻 3 号 p. 293-298
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