抄録
Silicon-based micro fuel cells are considerable interest for micro electromechanical system (MEMS) devices. Micro pattern fabrication by photolithography and etching process is effective for minimization of fuel cells. It is known that the photolithography process is difficult to employ for an electrolyte of perfluorosulfonic acid (PFSA) film due to swelling and peeling under wet process. In order to prevent the problems, a hexamethyldisilazane (HMDS) primer treatment is employed on the interface of photoresist/PFSA. Consequently, photoresist/PFSA double layer structure can be formed on the Si substrate with no defect formation. The double layer structure is selectively etched by reactive ion etching (RIE) process with CF4 gas in order to fabricate the micro pattern of PFSA film. The effect of HMDS primer treatment is observed as a hydrophobic effect by an analysis of wetting energy. The PFSA film with HMDS primer treatment should prevent to penetrate the liquid into the PFSA film under wet process.
