2014 年 27 巻 2 号 p. 211-217
An alkaline-developable positive-type photosensitive polyimide (PSPI) based on fluorinated poly(amic acid) (FPAA) and fluorinated diazonaphtoquinone (FDNQ) as a photoactive compound has been successfully developed as a promising material for use in microelectronics. The FPAA was prepared from 4,4’-(hexafluoroisopropylidene)diphtahlic anhydride and aromatic diamines, 4,4’-oxydianiline (80 mol%), and 4,4’-oxybis(4-phenoxyaniline) (20 mol%). The PSPI consisting of FPAA, catechol (3 wt% to FPAA), and FDNQ (25 wt % to FPAA) showed a high sensitivity of 45 mJ/cm2 and a high contrast of 10 when it was exposed to a 365 nm line (i-line), and developed with 2.38 wt % TMAHaq for 10 seconds at room temperature. A clear positive image of a 6-μm line and space pattern was printed on a film, which was exposed to 80 mJ/cm2 of i-line by a contact printing mode. Thus, this system will be a good candidate for next generation PSPIs.