Abstract
Extreme ultraviolet lithography (EUVL) has been an attractive method as next generation lithography (NGL) over 20 years, and high-volume manufacturing (HVM) is now going to be realized by great progresses in materials as well as EUV source power enhancement. In this paper, recent reported materials for EUVL are summarized ranging from conventional organic material base resists to novel inorganic material base resists.
