Improvement of Post Exposure Delay of Photo-Patternable and Adhesive Materials for Wafer-Scale Microfluid

Abstract

In order to simplify the wafer-scale fabrication of microfluidic devices JSR has developed a photo-patternable and adhesive (PA) material which allows to pattern and bond microfluidic structures in one single process step. Control over the film thickness and excellent patterning properties are crucial for many microfluidic applications. By optimizing the acid diffusion after exposure, improved PA patterning properties were achieved. This in combination with the possibility to pattern 80 μm thick structures makes PA an ideal material candidate for many microfluidic and BioMEMS applications.