Journal of Photopolymer Science and Technology
Online ISSN : 1349-6336
Print ISSN : 0914-9244
ISSN-L : 0914-9244
Effects of Friction Coefficient and Cohesion between a Mold and a Polymer Resist during Demolding Process in Hot Embossing
Rui ZhangQing WangXu ZhengLijun MaJintao Zhang
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JOURNAL FREE ACCESS

2016 Volume 29 Issue 1 Pages 39-44

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Abstract

Pattern fidelity in hot embossing is influenced to a large extent by defects induced with mold releasing from polymer resist. It is necessary to investigate contact properties of interface between the mold and the polymer resist during demolding process. In this paper, influences of friction coefficient and cohesion on deformation in the polymer resist during the demolding are studied via finite element method. An optimization finite element model with nickel mold/polymer resist structure was constructed, considering both mechanical properties of the polymer resist and optimal element number. Simulation results show that there exist the optimum friction coefficient and the optimum cohesion allowing the deformation of the polymer resist to be minimal. These optimum contact properties can be applied in guiding selections of material and improving quality of embossed patterns.

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© 2016 The Society of Photopolymer Science and Technology (SPST)
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