Development of Novel Low-temperature Curable Positive-Tone Photosensitive Polyimide with High Elongation

Abstract

Recently, progress of semiconductor packaging is drastic and multi-pinned devices such as Fan-out Wafer Level Packages (FOWLPs) attract much attention. For those applications, photosensitive polyimides (PSPIs) are applied as re-distribution layers (RDLs) and they are required to have high level of properties such as adhesion to metal and reliability. We developed novel low-temperature curable positive-tone photosensitive polyimides (posi-PSPIs) with high elongation, strong adhesion to the copper RDLs, and high chemical resistance for establishing the multi RDLs by improving the base-polyimides and incorporating polyimides with cross-linkers and adhesion promoters.