Challenges and Progress in Low Defectivity for advanced ArF Lithography Processes using Surface Localized Material Technology

Abstract

The main challenge in ArF lithography is to reduce cost of ownership (CoO) because increase in multi-patterning process is generally required to obtain a fine pattern. As a consequence, industry strongly requires ArF lithography process with a fast scan speed scanner and low defectivity material for CoO. The breakthrough technology to improve defectivity and resolution simultaneously was the polarity-change property of film surface from hydrophobic to hydrophilic after alkaline development process because a property after development process should be only associated with defectivity, not with fast scan speed. The materials with high polarity change function were explored to EUV process to achieve low defectivity with good lithography performances.