Analysis of Debonding Problem during Demolding Process of Nanoimprinting

Abstract

Template release process during nanoimprint lithography was investigated, and the detailed steps of this process were described in order to reduce defects caused by demolding process. The debonding problem was discussed by using optimization of model, numerical simulation and theoretical analysis. The rules and mechanism of debonding were obtained by analyzing the relations between the bonding strength and the vertical stresses of the cementing surface linking the residual layer and the substrate in terms of stress balance theory in fracture mechanics. The location and demolding process which is prone to debond were analyzed. It is concluded that the debonding phenomenon took place at the intermediate position during the second demolding stage, when the adhesion force between the resist and the mold was 0.8 times of other interfaces between the mold and the resist. The debonding phenomenon took place at the angular position during the fourth demolding stage, when the adhesion force between the resist and the mold was 1.2 times bigger than the other interfaces between the mold and the resist.