Development of Low-Residual-Stress Photosensitive Adhesive Materials for Wafer-Scale Microfluidic Device Fabrication

抄録

We have previously developed a photosensitive adhesive material that enables microfluidic channel structure formation and subsequent bonding to a cover with the aim of simplifying the process of wafer-scale microfluidic device fabrication. However, the bonding process and a subsequent curing process required heat treatment at 200 ℃ and 180 ℃, respectively, resulting in the generation of relatively high residual thermal stress. This may lead to delamination, warping, and cracking depending on the application environment. Therefore, in the present study, we designed a new material platform in which the patterning, bonding, and curing processes are based on ultraviolet (UV) reaction of polyfunctional acrylate, tackiness of epoxy resin, and UV/thermal reaction of epoxy resin in order to achieve low residual stress through low-temperature processing. Proof of concept was conducted through the evaluation of various physical properties of the system and found that the new type of photosensitive adhesive material, which bonded to a cover and cured at lower temperatures of 100 ℃ and 120 ℃, respectively, had a low residual stress of 10 MPa and good insulation reliability. This is a promising material for applications such as cooling devices for semiconductor chips, where long-term reliability is required.