Polyimide-based Release Material for Rapid and Precise Mass Transfer of Semiconductor Chips

Abstract

In this paper, we report efficient release material which can bond semiconductor chip like micro LED and transfer onto substrates by laser rapidly and precisely. The micro LEDs were mounted on this release material from the sapphire substrate by laser lift-off process with 100% yield. We succeeded in high-speed transfer of micro LEDs using an UV laser. Furthermore, we demonstrated that even extremely thin and fragile semiconductor chips with a thickness of 0.8 μm could be transferred without any damage.