Abstract
We developed a new positive working photosensitive polymer for semiconductor surface coating. Base resins were considered three kinds of heat-resistance polymers and we found that polybenzoxazole precursors(PBO) with photosensitizer diazonaphtoquinones and silicone modified polyamic acids added as adhesion promoters showed excellent patterning properties and film properties. Cured film of this photosensitive PBO also has not only low water absorption and low dielectric constant, but also high adhesion to substrates such as SiO2, Si3N4 and molding compounds. The evaluation results of reliability made for this photosensitive PBO on testing elements was the same as that for existing non-photosensitive polyimides; it was found that the photosensitive PBO was on a practical level.
