Journal of Photopolymer Science and Technology
Online ISSN : 1349-6336
Print ISSN : 0914-9244
ISSN-L : 0914-9244
Materials and Resists for 193 and 157nm Applications
Munirathna PadmanabanEric AlemyJun-Bom BaeWoo-Kyu KimTakanori KudoSeiya MasudaDalil RahmanRaj SakamuriRalph DammelJae-Chang JungSung-Koo LeeKi-Soo Shin
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2001 Volume 14 Issue 4 Pages 631-642

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Abstract
Polymeric materials and resists for 193 and 157nm applications have shown good progress. Improvements and status in the area of methacrylate, cyclo-olefin/maleic anhydride (COMA), hybrid polymers and resists derived from these polymers are highlighted. While methacrylate polymers based on 2-methyl adamantyl methacrylate (MAdMA) continue to show excellent performance for contact and dense line and space applications, hybrid type polymers consisting of (among others) t-Butyl-5-norbonene-2-carboxylate (BNC), MAdMA and maleic anhydride exhibit the best performance for semi-dense and isolated line and space applications. Lithographic performance of representative formulations AZ® EXP AX™ 1020P, AZ® EXP AX™ 1040P, and AZ® EXP AX™ 2020P derived from each type of polymers are provided. A first 157nm resist system based on copolymers of norbornene-5-methylenehexafluoroisopropanol (NMHFA) and BNC, formulated with an additive obtained by copolymerization of t-butyl norbornene-5-trifluorom thyl-5-carboxylate (BNTC) with carbon monoxide demonstrating dense L/S resolution down to 90nm with >85° wall angle is also presented.
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© The Technical Association of Photopolymers, Japan
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