抄録
Benzocyclobutene (BCB) polymer was developed at Dow Chemical in the late 1980's for microelectronics packaging and interconnect applications. Photo-definable BCB formulation was commercialized in 1994. The Dielectric polymer films produced from BCB formulations possess many desirable properties[1] [2] [3] [4] for microelectronic applications; for example, low dielectric constant and dissipation factor, low moisture absorption, rapid curing and low temperature cure without generating by-products, minimum shrinkage in curing process, and no Cu migration issues. Derived from these properties, applications have been developed in: bumping/wafer level packaging [5][6], Ga/As chip ILD [7], optical wave guide [8], flat panel display [9], and lately in BCB-coated Cu foil for build-up board [10]. This article summaries the chemistry, the relevant properties and the typical process of photo definable divinylsiloxane bisbenzocyclobutene (DVS-BCB) commercialized by Dow Chemical as CYCLOTENETM resin system.
