Abstract
The rapid performance improvement being made in microprocessors, video compression and so on will open up the multimedia environments near future. Higher performance, lower power and lower cost requirements in leading-edge logic LSIs push the MOSFET miniaturization and fine multi-level interconnection beyond DRAM. This requires the lithography improvement more and more. Fine line resolution/control will be one of the most difficult technical challenge in lithography. These technical challenge should be solved from the total process optimaization standpoint, which include the unit process and process integration.
