2018
Conference information
Host: The Institute of Industrial Applications Engineers
Name : IIAE Annual Conference 2018
Number : 6
Location : [in Japanese]
Date : September 13, 2018
CoC Bonding Technology with Al-Si/TiN Bumps for Narrow Pitch Bonding
*Masahiro Akiyama, *Takahiro Mitsuishi, *Dali Zhang, *Myung-Jae Lee, *Edoardo Charbon
Author information
Pages 47-48
Details
