Abstract
Chemical Mechanical Polishing(CMP) is essential for the manufacturing of recent high–performance electronic device. However, for the CMP process,huge amount of slurry is used, which is to be disposed after being used only once. From the viewpoint of reduction of environmental burdens, this study was made for exploring the possibility of recycling of slurry by focusing on the slurry used for W–CMP. For that purpose, we collected the slurry used for polishing and then tried to reuse it for polishing again. As a method for evaluation, We made comparisons of removal rates between fresh slurry and reused slurry. The results shows that when collecting the slurry during CMP,it contained the water remained on the surface of the polishing pad after dressing, by which slurry was diluted and caused the reduction of removal rate of W–film. However,it was found that when making polishing of W–film using the slurry reused without being diluted with water, the same level of removal rate as fresh slurry is obtained.
