High Spatial Resolution Machining Utilizing Atmospheric Pressure Plasma

Abstract

The machining method which has high spatial resolution and mass productivity at the same time is required in the field of semiconductor manufacturing but also the field of biotechnology etc. To satisfy this request, we developed the new machining method utilizing atmospheric pressure plasma. In this method, fluorine radicals generated in the plasma are blown off to the workpiece surface from small size orifice which has diameter of 10 – 20μm. We achieved that 130μm as a spatial resolution, and also achieved 0.01mm³/h as an etching rate.