Development of Manufacturing Equipment for 3D Micro-devices using surface-activated bonding

Abstract

We have been developing a novel 3D micro–fabrication method (FORMULA technology) and a manufacturing equipment for 3D micro–devices such as micro optical devices and high accuracy MEMS etc.
In this method, a 3D microstructure is fabricated by stacking thin film patterns using surface–activated bonding at room temperature. Therefore, accuracy of 3D microstructure is influence by accuracy of positioning stage greatly.
We developed a fine positioning stage with high accuracy (positioning accuracy of 50nm) and maximum axial load (1ton). Additionally, This stage succeeded in controlled also in vacuum systems with base pressures of 10^–6Pa. In consequence, 3D microstructure with 150nm accuracy was achieved by applying this stage and FORMULA technology in manufacturing equipment.