Proceedings of JSPE Semestrial Meeting
2006 JSPE Spring Meeting
Session ID : G38
Conference information

Host: The Japan Society for Precision Engineering

Study on Silicon Lapping with Soft Plane Tools
*Masayoshi Gido, Toshio Kasai, Hideaki Narahara, Hiroki Horiguchi
Author information
Keywords: silicon wafer, lapping, soft plane tool, stock removal, surface roughness
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (314K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2006 The Japan Society for Precision Engineering
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top