Proceedings of JSPE Semestrial Meeting
2010 JSPE Autumn (Spring) Conference
Session ID : B37
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Creation of a filling-hole surface by using CAE simulation
*Shigeki TanimotoHiroyuki NakamuraHiromasa Takei
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Keywords: CAD, CAE, FEM, Filling-Hole, Dieface
CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
Die designers need to fill the holes in the product surface data in order to create the corresponding stamping die data. Conventional methods for hole-filling calculated the filling surface mathematically from the continuity conditions along the hole boundary curves, but often the result surface was not adequate for the stamping process. Based on the idea that the shape of the plane panel when pressed towards the product surface near the hole would be appropriate for the stamping process, the authors developed a new method in which the panel deformation is computed using a CAE simulation and the hole-filling surface is created from its result.
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© 2010 The Japan Society for Precision Engineering
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