2011 JSPE Autumn Conference
Session ID : F34
Conference information
Host: The Japan Society for Precision Engineering
Resist coating inside TSV in the fabrication process of 3D stack devices
- 2nd report: Measurements and applications using nano-imprinting of TSV patterns-
*Toshiro Doi, Masanori Ohtsubo, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Keiji Miyachi, Yoshiyuki Seike, Kenji Maruyama, Takuji Kotani, Ken Ohashi
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