Proceedings of JSPE Semestrial Meeting
2011 JSPE Spring Conference
Session ID : B74
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Host: The Japan Society for Precision Engineering

Analysis of crack propagation in radius direction round modified layer in stealth dicing
*Tomohiro Nakamura, Etsuji Ohmura, Junji Okuma
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Keywords: dicing, silicon wafer, crack, thermal stress analysis
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[in Japanese]
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© 2011 The Japan Society for Precision Engineering
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