2011 JSPE Spring Conference
Session ID : F63
Conference information
Host: The Japan Society for Precision Engineering
Development of Electro-adhesive Chuck for High-speed Transfer of Wafer in Vacuum
*Yoshihiko Shida, Yasuhiro Kakinuma, Tojiro Aoyama, Hirofumi Minami, Hidenobu Anzai
Author information
Keywords:
Functional Materials,
Electro-adhesive Effect,
Semi-conductor Process,
Fixture Device,
Si wafer
Details
