2011 JSPE Spring Conference
Session ID : G14
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Host: The Japan Society for Precision Engineering
Dicing of SiC wafer by PCVM (Plasma Chemical Vaporization Machining) with shadow mask
*Hiroaki Nishikawa, Yasuhisa Sano, Kouhei Aida, Kazuya Yamamura, Satoshi Matsuyama, Kazuto Yamauchi
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