Proceedings of JSPE Semestrial Meeting
2011 JSPE Spring Conference
Session ID : G13
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Damage-free planarization of 2-inch 4H-SiC Substrate utilizing Fe abrasive particles
*Akihisa KubotaMuasahiko YoshimuraYuya IchimoriYoshitaka NakanishiMutsumi Touge
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Keywords: SiC
CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]
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© 2011 The Japan Society for Precision Engineering
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