抄録
The present work deals with the experimental investigation of ultrasonic assisted scratching (UAS) tests of SiC ceramics with single diamond tool in order to reveal the material removal mechanism in ultrasonic assisted internal grinding of SiC ceramics. The experiment results show that the machining force in UAS varies periodically, and the mean value of the force is smaller than that in conventional scratching process without ultrasonic vibration. The profile of scratching trace indicates that the scratching path appears to be sinusoidal when ultrasonic vibration is applied. It is probably attributed to the impact effects of the tool generated in UAS process.
