精密工学会学術講演会講演論文集
2013年度精密工学会春季大会
セッションID: C35
会議情報

MCFポリシングにおける研磨力の分布と材料除去の関係
*郭 会茹呉 勇波藤本 正和野村 光由
著者情報
キーワード: MCF研磨, 力の分布, 材料除去
会議録・要旨集 フリー

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抄録
Knowledge of the forces distribution is essential to understand the material removal mechanism of MCF polishing process. The accumulated polishing forces are measured by moving the MCF slurry along its diameter direction with a certain step and the distributions of the pressure and shear force during MCF polishing are calculated. The closer to the center of MCF slurry, the larger the pressure is. The maximum shear force is generated at the position of about 5mm from the center of MCF slurry. The relationship between forces distribution and material removal is studied and a material removal model is proposed.
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© 2013 公益社団法人 精密工学会
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