Development of Auxiliary Plate: SAISEI ECO CAP® and Its Related Technique for Polishing Pad Reusable System

1st Report: Reusable Method and Its Characteristics

Abstract

The most of polishing pads in the CMP (Chemical Mechanical Polishing) process are disposed of industrial waste without being reprocessed after use. In order to reuse these old polishing pads, we have developed the auxiliary plate. The purpose of this paper is to evaluate this auxiliary plate adaptability on the polisher, and to demonstrate the impact of regenerated pad on the polishing performances. As a result, there are no statistically significant differences between the polishing pad with/ without the auxiliary plate. In addition, the regenerated pad does not affect the removal rate and the uniformity.