Abstract
Diamond-like Carbon (DLC) is a semiconductor with high hardness, low friction coefficient, corrosion resistance etc., so it is applied to a variety of mechanical components. On the other hand, electrical resistance of DLC is as high as 107˜1014Ω·cm. For this reason, there are many researches to attempt to supersede SiO2 for DLC. In this research, we deposited DLC on glass substrates by plasma-CVD and FCVA (Filtered Cathodic Vacuum Arc) method, measured the electro resistivity by 2 electrode method, and evaluated thermal resistance using electric furnace tests. Effect of deposition method and deposition conditions on electrical and thermal properties of DLC films has been clarified.
